Our Services

Northern Technische Consulting Sdn. Bhd. provides high-quality industry-centric technical training courses in Semiconductor Wafer Fabrication Technology & Processes, Semiconductor Materials, Power Semiconductor, Optoelectronics, Silicon Photonics, Microelectromechanical System (MEMS) & Sensor Technology,  Solar Photovoltaic, Analogy & Digital Circuit Design, VLSI Design, Embedded Systems, Electrical & Physical Failure Analysis, Reliability Engineering, Defect & Yield Engineering, Product & Test Engineering, Design-of-Experiment, Systematic Problem Solving & 3×5 Why Analysis, Technical Article & Report Writing

Electronics & Integrated Circuit VLSI Design for Semiconductor

EE01-1 Practical Analog and Digital Circuit Design - Part 1 (3 Days)
Course Overview: The course participants shall learn the fundamentals and the design of electronic circuits using modern semiconductor devices. Analog and Digital Circuit design are covered. • Enable participants to use modern circuit simulation software to design basic analog and digital circuits. • Enable participants to read and understand of datasheets of commercial circuits. • Enable participants to design parts of analog and digital components and structures, and to select and to choose suitable electronic components for specific engineering applications. • Enable participants to effectively participate and work together with an interdisciplinary team for the design and application of modern electronic devices.
EE01-2 Practical Analog and Digital Circuit Design - Part 2 (3 Days)
Course Overview: The course participants shall learn the fundamentals and the design of electronic circuits using modern semiconductor devices. Analog and Digital Circuit design are covered. • Enable participants to use modern circuit simulation software to design basic analog and digital circuits. • Enable participants to read and understand of datasheets of commercial circuits. • Enable participants to design parts of analog and digital components and structures, and to select and to choose suitable electronic components for specific engineering applications. • Enable participants to effectively participate and work together with an interdisciplinary team for the design and application of modern electronic devices.
EE03-1 VLSI Design - Part 1 (3 Days)
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EE03-2 VLSI Design - Part 2 (3 Days)
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EE05-1 Design Patterns for Embedded Systems - Part 1 (3 Days)
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EE05-2 Design Patterns for Embedded Systems - Part 2 (3 Days)
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EE07-1 Multiprocessor and Multi-core Designs for Reliable Embedded Systems - Part 1 (3 Days)
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EE07-2 Multiprocessor and Multi-core Designs for Reliable Embedded Systems - Part 2 (3 Days)
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EE09-1 Electronics Reliability - Part 1 (3 Days)
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EE09-2 Electronics Reliability - Part 2 (3 Days)
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Microelectromechanical System (MEMS)

MM01-1 Fundamentals of MEMS, Products and Technology (3 Days)
Course Overview: From being an emerging technology spun out of traditional semiconductor device and integrated circuits industry, MEMS products are now seeing an explosion in demand, driven by products such as smart phones, intelligent cars, wearable technology and the internet of things (IoT). The aim of this introductory course is to equip engineers, scientists and technical managers with fundamental knowledge relating to MEMS products and technology. After completing the course, participants will gain thorough insight into: • The Fundamentals of MEMS Products and Technology • The most important MEMS Products in the Market Today • The Fundamentals of MEMS Microfabrication • MEMS Sensors and Actuators
MM01-2 MEMS Design, Packaging and Testing (3 Days)
Course Overview: From being an emerging technology spun out of traditional semiconductor device and integrated circuits industry, MEMS products are now seeing an explosion in demand, driven by products such as smart phones, intelligent cars, wearable technology and the internet of things (IoT). The aim of this advanced course will equip attendees with the tools and methods for MEMS design and simulation, along with a detailed understanding of advanced MEMS fabrication and packaging. After completing the course, participants will gain thorough insight into: • MEMS Design Methods and Tools • Integration of MEMS and Standard IC Technology • MEMS packaging • MEMS Parametric Testing • The Future Direction of MEMS
MM02 MEMS Technology

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MM03 Microfluidic Devices

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Semiconductor Wafer Fabrication Technology

SC01 Semicondutor Devices, Technologies and Characterization (2 Days)
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SC02 Microfabrication Processes in Semiconductor (2 Days)
Course Overview: This course introduces the key units of microchip fabrication processes to a wide audience who has little or no experience in wafer fabrication. The intended audience for this course is two-fold: (1) suppliers to wafer fab (i.e. silicon substrates, chemicals, gases, process utilities, building facility, etc), and (2) customers of wafer fabrication product (downstream semiconductor assembly, test, and packaging industries). The objective of this course is to lay the solid foundations that are needed to understand wafer fabrication processes in semiconductor industry. Upon completion, participants will be able to return to work with a more positive mindset and participate constructively in semiconductor fabrication related discussions.
SC03 Essentials of Materials Science And Engineering In Microelectronics (2 Days)
Course Overview: Materials science and engineering is a branch of study that relates to the processing, structure and properties of materials. This course has a broad coverage in the fundamental knowledge of materials that today’s engineers need, targeting those who are working in the microelectronics or electronics industry. Upon completion of this course, the participant will have a deeper understanding of the underlying principles and relation of engineering properties (electrical, optical, mechanical, chemical) to the basic structure of materials.
SC04 Thin Films Science - Technologies and Characterization (2 Days)
Course Overview: The course is designed to give each participant a comprehensive overview of thin film deposition techniques that are commonly used in high volume semiconductor wafer fabrication. Supplement to the growth films is the necessity to analyze the surface, layers, grain boundaries or the other interfaces with the aim to control the process and eventually to meet the technological requirements.
Upon completion of the course, the participant will gain a deeper understanding of the physics relevant to various deposition technologies relating to thin films and the practical characterization methods employed in the semiconductor wafer fabrication industry.
SC05 Power Semiconductor Device Technology: MOSFET, Diodes, IGBTs (3 Days)
Course Overview:  This course shall expose the participants to the evolution of the MOSFET technology across the three phases of technology revolution in transistor manufacturing, i.e. scaling revolution, material revolution and structural revolution from high speed to powercentric device performance. At the beginning of the course, participants are given a fundamental review of the starting materials and building blocks that make up the versatile MOSFET transistor. The participants are refreshed on the physical concepts simplified for understanding the basic operations of the incumbent MOSFET design. This serves as the foundation for subsequently appreciating the innovative material design concepts incorporated into the MOSFET on bulk silicon substrate discussed and shown to offset the short channel effects that would otherwise severely degrade the excellent performance of the transistor, when scaling from microelectronic into nanoelectronic regime and for application into power devices. The physics of the semiconductor breakdown process will be covered and the types of commonly used power semiconductor devices will be discussed, i.e. Schottky rectifier, power MOSFET and IGBT.
SC07 Silicon on Isolator (SOI), Characteristics and Benefits, SOI Transistors, and Fabrication Process (2 Days)
Course Overview:  At the beginning of the course, participants are given a fundamental preparation and SOI Eco-system. The review on the concept of Silicon-On-Insulator (SOI) materials, SOI substrate participants are shown how the adaptation of SOI technology can effectively counter the effects of short channel scaling in the incumbent MOSFET design. The deployment of SOI continually drives the evolution of MOSFET technology into deep nanometer regime and ensures the advancement of modern integrated circuits closely follow Moore’s Law – a symbolic feat of engineered structures at nanometer scale. Upon completion of the course, participants will be able to: • Appreciate the characteristic features of Silicon-on-Insulator (SOI) wafers in term of material growth and wafer preparation. • Relate the physical concepts of Building Blocks to performance of MOSFETs on SOI. • Understand the basic operations of MOSFETs on SOI substrates including distinctive advantages and issues over Bulk Si substrate.

Optoelectronics & Silicon Photonics

OP01 Essentials of Optics and Optical Materials for LED (2 Days)
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OP01-Essentials of Optics and Optical Materials for LED
OP02 Essentials of Phosphor Technology (2 Days)
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OP02-Essentials Of Phosphor Technology
OP03 Optoelectronic Device and Packaging (2 Days)
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OP03-Optoelectronic Device and Packaging
OP04 Photometry and Calorimetry (2 Days)
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OP04-Photometry and Calorimetry
SP01 Silicon Photonics - Fundamental and Devices Technology Part 1 (3 Days)
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SP02 Silicon Photonics - Fundamental and Devices Technology Part 2 (3 Days)
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Essential Engineering Skills

ES01 8D Systematic Process, Methods, Tools and 3x5 Why Analysis (3 Days)

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ES02 Technical Report & Article Writing For Journal Publication (2 Days)
Course Summary: This course concentrates on the essential aspects of writing effective and quality technical papers common in format suitable mainly for technical proposals, conference presentation, defensive presentation, journal papers, and technical reports, including the highlights on the mechanics of publication submission, delivered through lectures interlaced with hands-on examples. Participants are encouraged to submit own brief write-up for review to identify strengths and weakness for optimum learning and understanding of the writing process. The general publication framework and journal submission experience shall be covered. Upon a successful completion of this course, participants will be able to: • Design suitable Defensive Publication Strategy. • Comprehend Journal Publication Process. • Appreciate importance of Legible Writing and Presentation. • Implement effective Technical Writing Strategy. • Submit publications to publishers including Peer-Review Journals.

 

Premium Training Courses (International Top Experts)

Ostbayerische Technische Hochschule Regensburg (OTH) Courses

OTH01 Analog and Digital Electronics for Semiconductor

Sypnosis : Participants shall learn the fundamental design of electronic circuits using modern semiconductor devices. Analog and digital circuit design is covered. At the end of the training course, participants should be able to use modern circuit simulation software to design basic analog and digital circuits, as well as reading and understanding of datasheets of commercial circuits.

OTH02 Product Engineering In Semiconductor Manufacturing

SypnosisSemiconductor industry basics (semiconductor technology, product design, wafer production (frontend), assembly (backend), test, quality) • Product development: analog design, digital design, physical layout, design re-use, usage of macros and libraries • Test development and productive test: test concept, analog-/digital/memory-/RF-/power-test, test time, test cost, difference of test during characterization/ verification/qualification and production test (wafer level, package level) • Production ramp up – from prototype/development to high volume production (production start and volume ramp) • Safe-launch concepts for production start and volume ramp • Key performance indicators of semiconductor industry • Optimization of semiconductor production (of key performance indicators) by optimization of process technology, product design, test flow and production process flow • How to deal with deviations or disturbances in development and/or production process • How to manage changes or updates – change management • Traceability of products throughout the production and logistics process as a major requirement for high quality production 

OTH02-Electronic Product Engineering

OTH03 Laser Technology (focus on short-pulse lasers), Optical Sensors, Technical Optics

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OTH04 LED Technology

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OTH04-LED Technology

OTH05 MEMS & Sensor Technology

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OTH06 MN Micromachining and Nanotechnology

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OTH07 Non-Volatire Memories (NVM), Flash, EEPROM, NVRAM)

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OTH08 Power Semiconductor Technology, Devices: Power Diode, MOSFET, IGBT, Power IC, BCD

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OTH09 Wet Processes For Semiconductor Wafer Fabrication

 

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